With the Snapdragon 888 Plus 5G just released barely a month ago, it seems that Qualcomm would already be preparing for the next generation of top-of-the-line mobile processors, with the appearance of new leaks of the Snapdragon 898 (also rumored as Snapdragon 895), which show us the main capabilities and specifications of the next SoC.
As shared by the well-known leaker Ice Universe on Weibo, the Snapdragon 898 will again involve a new core design change compared to the current chipset, moving from the recently adopted ARM Cortex-X1 to the newer Cortex-X2, increasing from 2.84 GHz to 3.09 GHz of the Kryo 780. A 10% speed increase that, although by itself is not so shocking, will be accompanied by other new improvements.
Qualcomm’s next flagship SoC is expected to be built using a 4nm process, probably by Samsung. In addition, the Snapdragon 898 could also equip the new Adreno 730 GPU along with the 4nm X65 5G modem, adding up to notable improvements in all areas of use and performance.
However, there are still some doubts about whether this new processor will also include some improvement or change in terms of thermal management. Previously we already saw how some of the smartphones using the Snapdragon 888 had supposedly had heat problems, with examples such as the OnePlus 9. And is that no doubt this increase in power will definitely involve an increase in the heat generation of the same, something that should not only depend on the additional cooling systems of the phones themselves, but that Qualcomm is expected to have addressed.
Thus, it is expected that the first mobile devices equipped with these new processors will begin to be announced later this year, reaching the market from early next year.